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31.180 Plošné spoje a desky s plošnými spoji

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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

Vydáno: 2021-11-05

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22/30453836 DC
BS EN 60194-2. Printed boards design, manufacture and assembly. Vocabulary Part 2. Common usage in electronic technologies as well as printed board and electronic assembly technologies

Vydáno: 2022-12-16

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BS IEC 62899-202:2023
Printed electronics Materials. Conductive ink

Vydáno: 2023-05-25

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23/30474274 DC
BS EN IEC 63267-3-81. Fibre optic interconnecting devices and passive components. Connector optical interfaces for enhanced Macro bend multimode fibre Part 3-81. Connector parameters of physically contacting 50 μm core diameter fibres. Non-angled polyphenylene sulphide rectangular ferrules with a single row of 12, 8, 4, or 2 fibres for reference connector applications

Vydáno: 2023-05-26

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23/30474639 DC
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths

Vydáno: 2023-06-02

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BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink

Vydáno: 2023-06-08

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23/30477815 DC
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation for printed electronics

Vydáno: 2023-08-02

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BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer

Vydáno: 2023-08-23

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BS IEC 62899-202-9:2023
Printed electronics Materials. Conductive ink. Printed patterns for mechanical test

Vydáno: 2023-10-26

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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate

Vydáno: 2024-02-07

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BS EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method

Vydáno: 2024-06-04

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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology

Vydáno: 2014-10-31

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254 results

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