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Homepage>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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257 results
First page123468...202122Last page
BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Vydáno: 2006-02-01
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BS EN 61086-3-1:2004
Coatings for loaded printed wire boards (conformal coatings) Specifications for individual materials
Vydáno: 2004-05-21
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BS EN 123400-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
Vydáno: 1991-12-20
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BS 123200:2001
System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
Vydáno: 2001-12-17
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61249-3-5:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Transfer adhesive films for flexible printed boards
Vydáno: 1999-06-15
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BS EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2013-04-30
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Vydáno: 2019-07-12
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BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
Vydáno: 2018-04-13
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257 results
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