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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Vydáno: 2015-04-30
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
Vydáno: 1998-12-15
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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
System of quality assessment. Sectional specification. Rigid multilayer printed boards
Vydáno: 2001-12-17
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PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Vydáno: 2015-12-16
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23/30474639 DC
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
BS EN IEC 62899-402-1. Printed electronics Part 402-1. Printability. Measurement of qualities. Line pattern widths
Vydáno: 2023-06-02
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BS IEC 62899-202:2023 - TC
Tracked Changes. Printed electronics Materials. Conductive ink
Tracked Changes. Printed electronics Materials. Conductive ink
Vydáno: 2023-06-08
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