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31.190 Sestavy elektronických součástek

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BS EN 60068-2-83:2011
Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Vydáno: 2011-11-30

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BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Vydáno: 2018-11-13

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Vydáno: 2021-03-19

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BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components for through-hole reflow (THR) soldering

Vydáno: 2021-03-18

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BS EN 60939-2-2:2004
Complete filter units for radio interference suppression Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (safety tests only)

Vydáno: 2005-02-08

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BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies

Vydáno: 2019-10-07

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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards

Vydáno: 2019-04-01

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BS EN IEC 61190-1-3:2018 - TC
Tracked Changes. Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Vydáno: 2020-02-27

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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies

Vydáno: 2022-09-13

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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology

Vydáno: 2015-04-30

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BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)

Vydáno: 2010-06-30

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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate

Vydáno: 2019-11-18

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