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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods

Vydáno: 2015-07-31

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DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

Vydáno: 2008-10-31

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BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods

Vydáno: 2017-04-30

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BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies

Vydáno: 2006-09-29

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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints

Vydáno: 2012-03-31

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BS EN 62421:2007
Electronics assembly technology. Electronic modules

Vydáno: 2007-12-31

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

Vydáno: 2021-08-20

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PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide

Vydáno: 2015-04-30

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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components

Vydáno: 2003-10-16

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BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Vydáno: 2018-03-28

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PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

Vydáno: 2022-10-31

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PD IEC TR 60068-3-12:2022
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

Vydáno: 2022-11-30

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80 results

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