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31.190 Sestavy elektronických součástek
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BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Vydáno: 2009-03-31
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195.84 €
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19.58 €
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58.75 €
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195.84 €
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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379.29 €
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37.93 €
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113.79 €
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379.29 €
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359.46 €
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35.95 €
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107.84 €
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359.46 €
BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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166.09 €
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16.61 €
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49.83 €
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166.09 €
BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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272.69 €
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27.27 €
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81.81 €
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272.69 €
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379.29 €
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37.93 €
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113.79 €
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379.29 €
BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Vydáno: 2002-08-16
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27.27 €
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81.81 €
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272.69 €
BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Vydáno: 2009-03-31
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272.69 €
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27.27 €
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81.81 €
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272.69 €
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24.79 €
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24.79 €
PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
Vydáno: 2024-02-07
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166.09 €
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16.61 €
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49.83 €
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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319.79 €
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31.98 €
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95.94 €
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319.79 €
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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195.84 €
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19.58 €
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58.75 €
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195.84 €