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31.190 Sestavy elektronických součástek

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BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly

Vydáno: 2014-06-30

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BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Vydáno: 2018-05-21

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BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies

Vydáno: 2017-07-31

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PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices

Vydáno: 2023-06-19

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PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering

Vydáno: 2024-04-08

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23/30436874 DC
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

Vydáno: 2023-10-23

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22/30383603 DC
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices

Vydáno: 2022-12-15

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PD IEC TR 60068-3-12:2022 - TC
Tracked Changes. Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

Vydáno: 2022-12-20

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries

Vydáno: 2022-08-23

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24/30502381 DC
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2

Vydáno: 2024-10-18

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21/30431274 DC
BS EN 61188-6-3. Circuit boards and circuit board assemblies. Design and use Part 6-3. Land pattern design. Description of land pattern for through hole components (THT)

Vydáno: 2021-01-06

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

Vydáno: 2021-08-20

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