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31.190 Sestavy elektronických součástek

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BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test

Vydáno: 2007-10-31

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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Vydáno: 2013-06-30

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BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases

Vydáno: 2021-10-11

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BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Vydáno: 2019-09-11

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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies

Vydáno: 2020-03-23

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21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices

Vydáno: 2021-12-03

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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library

Vydáno: 2021-01-22

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BS EN 61188-5-6:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides

Vydáno: 2003-06-26

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BS EN 60939-2-1:2004
Complete filter units for radio interference suppression Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (Assessment level D/DZ)

Vydáno: 2005-02-09

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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages

Vydáno: 2007-12-31

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BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly

Vydáno: 2014-06-30

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BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Vydáno: 2018-05-21

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80 results

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