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Homepage>IEC 60191-5:1997 - Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
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sklademVydáno: 1997-04-23
IEC 60191-5:1997 - Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

IEC 60191-5:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 5: Recommandations applicables aux boîtiers à transfert automatisé sur bande (TAB) des circuits intégrés

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Označení normy:IEC 60191-5:1997
Vydáno:1997-04-23
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 60191-5:1997

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

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