Homepage>IEC 60191-6-1:2001 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Sponsored link
sklademVydáno: 2001-10-30
IEC 60191-6-1:2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Format
Availability
Price and currency
Anglicky Hardcopy
skladem
22.69 €
Anglicky PDF
Immediate download
22.69 €
Označení normy:
IEC 60191-6-1:2001
Vydáno:
2001-10-30
Jazyk:
Anglicky
DESCRIPTION
IEC 60191-6-1:2001
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
