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sklademVydáno: 2011-06-08
IEC 60191-6-12:2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12: Règles générales pour la préparation des dessins d'encombrement des boîtiers des dispositifs à semiconducteurs à montage en surface - Lignes directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)
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| Označení normy: | IEC 60191-6-12:2011 |
| Vydáno: | 2011-06-08 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 60191-6-12:2011
IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised.