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sklademVydáno: 2010-01-07
IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)
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Anglicky/Francouzsky Hardcopy
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130.21 €
Anglicky/Francouzsky PDF
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| Označení normy: | IEC 60191-6-18:2010 |
| Vydáno: | 2010-01-07 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 60191-6-18:2010
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.