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Homepage>IEC 60352-8:2011 - Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance
sklademVydáno: 2011-02-10
IEC 60352-8:2011 - Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance

IEC 60352-8:2011

Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance

Connexions sans soudure - Partie 8: Connexions par compression - Exigences générales, méthodes d'essai et guide pratique

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Označení normy:IEC 60352-8:2011
Vydáno:2011-02-10
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 60352-8:2011

IEC 60352-8:2011 Is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.