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sklademVydáno: 2003-01-17
IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 16: Détection de bruit d'impact de particules (PIND)
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| Označení normy: | IEC 60749-16:2003 |
| Vydáno: | 2003-01-17 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 60749-16:2003
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).