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sklademVydáno: 2003-02-13
IEC 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19: Résistance de la pastille au cisaillement
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| Označení normy: | IEC 60749-19:2003 |
| Vydáno: | 2003-02-13 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 60749-19:2003
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.