Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQE-ReadingNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 60749-19:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Sponsored link
sklademVydáno: 2003-02-13
IEC 60749-19:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19: Résistance de la pastille au cisaillement

Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
22.56 €
Anglicky/Francouzsky PDF
Immediate download
22.56 €
Označení normy:IEC 60749-19:2003
Vydáno:2003-02-13
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 60749-19:2003

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

Print