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Homepage>IEC 60749-20:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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sklademVydáno: 2020-08-31
IEC 60749-20:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

IEC 60749-20:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : Résistances des CMS à boîtier plastique à l’effet combiné de l’humidité et de la chaleur de brasage

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Označení normy:IEC 60749-20:2020
Vydáno:2020-08-31
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 60749-20:2020

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.

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