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sklademVydáno: 2002-09-12
IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22: Robustesse des contacts soudés
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Anglicky/Francouzsky Hardcopy
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Anglicky/Francouzsky PDF
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| Označení normy: | IEC 60749-22:2002 |
| Vydáno: | 2002-09-12 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 60749-22:2002
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.