Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQE-ReadingNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 60749-22:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Sponsored link
sklademVydáno: 2002-09-12
IEC 60749-22:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22: Robustesse des contacts soudés

Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
178.19 €
Anglicky/Francouzsky PDF
Immediate download
178.19 €
Označení normy:IEC 60749-22:2002
Vydáno:2002-09-12
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 60749-22:2002

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

Print