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sklademVydáno: 2003-07-11
IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 25: Cycles de température
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| Označení normy: | IEC 60749-25:2003 |
| Vydáno: | 2003-07-11 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 60749-25:2003
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.