Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQE-ReadingNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 60749-35:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Sponsored link
sklademVydáno: 2006-07-18
IEC 60749-35:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

IEC 60749-35:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 35: Microscopie acoustique pour composants électroniques à boîtier plastique

Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
178.40 €
Anglicky/Francouzsky PDF
Immediate download
178.40 €
Označení normy:IEC 60749-35:2006
Vydáno:2006-07-18
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 60749-35:2006

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Print