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sklademVydáno: 2021-02-23
IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-1: Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes imprimées
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Anglicky/Francouzsky Hardcopy
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264.87 €
Anglicky/Francouzsky PDF
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| Označení normy: | IEC 61188-6-1:2021 |
| Vydáno: | 2021-02-23 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 61188-6-1:2021
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.