Menu
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 61189-2-721:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
sklademVydáno: 2015-04-29
IEC 61189-2-721:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

IEC 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

Methodes d'essai pour les matériaux éléctriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721: Méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique en anneaux fendus

Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
169.77 €
Anglicky/Francouzsky PDF
Immediate download
169.77 €
Označení normy:IEC 61189-2-721:2015
Vydáno:2015-04-29
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 61189-2-721:2015

IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.