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sklademVydáno: 2023-08-25
IEC 61189-2-804:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300
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| Označení normy: | IEC 61189-2-804:2023 |
| Vydáno: | 2023-08-25 |
| Edice: | 1 |
| ICS: | 31.180 |
| Počet stran (Anglicky/Francouzsky): | 16 |
| ISBN (Anglicky/Francouzsky): | 9782832274224 |
DESCRIPTION
IEC 61189-2-804:2023
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.