Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQE-ReadingNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 61189-2-804:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Sponsored link
sklademVydáno: 2023-08-25
IEC 61189-2-804:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

IEC 61189-2-804:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300

Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
22.64 €
Anglicky/Francouzsky PDF
Immediate download
22.64 €
Označení normy:IEC 61189-2-804:2023
Vydáno:2023-08-25
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 61189-2-804:2023

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

Print