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Homepage>IEC 61189-2-807:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
sklademVydáno: 2021-09-03
IEC 61189-2-807:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-807: Méthodes d’essai des matériaux pour structures d’interconnexion - Température de décomposition (Td) par analyse thermogravimétrique

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Označení normy:IEC 61189-2-807:2021
Vydáno:2021-09-03
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 61189-2-807:2021

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

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