Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQE-ReadingNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 61189-5-2:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Sponsored link
sklademVydáno: 2015-01-08
IEC 61189-5-2:2015 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

IEC 61189-5-2:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-2: Méthodes d'essai générales pour les matériaux et les assemblages - Flux de brasage pour les assemblages de cartes imprimées

Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
305.28 €
Anglicky/Francouzsky PDF
Immediate download
305.28 €
Označení normy:IEC 61189-5-2:2015
Vydáno:2015-01-08
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 61189-5-2:2015

IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering flux for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.

Print