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Homepage>IEC 61249-2-46:2018 - Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
sklademVydáno: 2018-01-10
IEC 61249-2-46:2018 - Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61249-2-46:2018

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-46: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, de conductivité thermique 1,5 W/(m•K) et d'inflammabilité définie (essai de combustion verticale), plaquées cuivre pour les assemblages sans plomb

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Označení normy:IEC 61249-2-46:2018
Vydáno:2018-01-10
Jazyk:Anglicky
DESCRIPTION

IEC 61249-2-46:2018

IEC 61249-2-46:2018 gives requirements for properties of non-halogenated epoxide non‑woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal Conductivity is defined to be (1,5 ± 0,2) W/(m•K).