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Homepage>IEC 62047-2:2006 - Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
sklademVydáno: 2006-08-15
IEC 62047-2:2006 - Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

IEC 62047-2:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 2: Méthode d'essai de traction des matériaux en couche mince

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90.67 €
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Označení normy:IEC 62047-2:2006
Vydáno:2006-08-15
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 62047-2:2006

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.