PRICES include / exclude VAT
Sponsored link
sklademVydáno: 2016-08-29
IEC 62047-25:2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 25: Technologie de fabrication de MEMS à base de silicium - Méthode de mesure de la résistance à la traction-compression et au cisaillement d'une micro zone de brasure
Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
178.19 €
Anglicky/Francouzsky PDF
Immediate download
178.19 €
| Označení normy: | IEC 62047-25:2016 |
| Vydáno: | 2016-08-29 |
| Jazyk: | Anglicky/Francouzsky |
DESCRIPTION
IEC 62047-25:2016
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.