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sklademVydáno: 2007-07-11
IEC 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Technologie de montage en surface - Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface - Partie 1-1: Essai de résistance à la traction
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| Označení normy: | IEC 62137-1-1:2007 |
| Vydáno: | 2007-07-11 |
| Jazyk: | Anglicky |
DESCRIPTION
IEC 62137-1-1:2007
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.