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Homepage>IEC 62878-2-602:2021 - Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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sklademVydáno: 2021-06-22
IEC 62878-2-602:2021 - Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Techniques d’assemblage avec appareil(s) intégré(s) - Partie 2-602: Lignes directrices pour un empilement de modules électroniques - Méthode d’évaluation de la connectivité électrique entre modules

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Označení normy:IEC 62878-2-602:2021
Vydáno:2021-06-22
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 62878-2-602:2021

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

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