Menu
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 63275-1:2022 - Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability
Sponsored link
sklademVydáno: 2022-04-21
IEC 63275-1:2022 - Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

IEC 63275-1:2022

Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

Dispositifs à semiconducteurs - Méthode d’essai de fiabilité pour les transistors à effet de champ métal-oxyde-semiconducteurs discrets en carbure de silicium - Partie 1: Méthode d’essai pour la mesure de la dérive de la tension de seuil après polarisation électrique en température

Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
90.56 €
Anglicky/Francouzsky PDF
Immediate download
90.56 €
Označení normy:IEC 63275-1:2022
Vydáno:2022-04-21
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC 63275-1:2022

IEC 63275-1:2022 gives a test method to evaluate gate threshold voltage shift of silicon carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs) using room temperature readout after applying continuous positive gate-source voltage stress at elevated temperature. The proposed method accepts a certain amount of recovery by allowing large delay times between stress and measurement (up to 10 h).