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11009 results

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IEC 60496:1975/AMD2:1992
Amendment 2 - Methods for measuring the performance of electric warming plates for household and similar purposes

Vydáno: 1992-10-14

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IEC 60510-1-4:1986
Methods of measurement for radio equipment used in satellite earth stations. Part 1: Measurements common to sub-systems and combinations of sub-systems. Section Four: Measurements in the baseband

Vydáno: 1986-01-01

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IEC 60512-11-13:2002
Connectors for electronic equipment - Tests and measurements - Part 11-13: Climatic tests - Test 11n: Gas tightness, solderless wrapped connections

Vydáno: 2002-02-21

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IEC 60512-1-1:2002
Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination

Vydáno: 2002-02-21

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IEC 60191-2:1966/AMD6:2002
Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Vydáno: 2002-05-01

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IEC 60191-6-16:2007
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Vydáno: 2007-04-26

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IEC 60191-2:1966/AMD11:2004
Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Vydáno: 2004-11-23

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IEC 60169-7:1975
Radio-frequency connectors - Part 7: R.F. coaxial connectors with inner diameter of outer conductor 9.5 mm (0.374 in) with bayonet lock - Characteristic impedance 50 ohms (Type C)

Vydáno: 1975-01-01

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IEC 60191-2:1966/AMD13:2006
Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Vydáno: 2006-07-17

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IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Vydáno: 2010-01-07

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IEC 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Vydáno: 2011-01-27

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IEC 60191-2:1966/AMD9:2003
Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Vydáno: 2003-11-19

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