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11218 results

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IEC 60169-9:1978
Radio-frequency connectors. Part 9: R.F. coaxial connectors with inner diameter of outer conductor 3 mm (0.12 in) with screw coupling - Characteristic impedance 50 ohms (Type SMC)

Vydáno: 1978-01-01

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IEC 60191-2:1966/AMD17:2008
Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Vydáno: 2008-05-27

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IEC 60191-5:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Vydáno: 1997-04-23

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IEC 60169-3:1965
Radio-frequency connectors - Part 3: Two-pin connector for twin balanced aerial feeders

Vydáno: 1965-01-01

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IEC 60169-3:1965
Radio-frequency connectors - Part 3: Two-pin connector for twin balanced aerial feeders

Vydáno: 1965-01-01

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IEC 60191-6-10:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Vydáno: 2003-11-19

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IEC 60216-1:2013
Electrical insulating materials - Thermal endurance properties - Part 1: Ageing procedures and evaluation of test results

Vydáno: 2013-03-15

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IEC 60216-4-1:2006
Electrical insulating materials - Thermal endurance properties - Part 4-1: Ageing ovens - Single-chamber ovens

Vydáno: 2006-01-19

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IEC 60204-33:2009
Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment

Vydáno: 2009-12-10

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IEC 60216-8:2013
Electrical insulating materials - Thermal endurance properties - Part 8: Instructions for calculating thermal endurance characteristics using simplified procedures

Vydáno: 2013-03-15

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IEC 60191-6-22:2012
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Vydáno: 2012-12-11

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IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Vydáno: 2000-09-29

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