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Homepage>IEC TR 60286-7:2019 - Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
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sklademVydáno: 2019-10-14
IEC TR 60286-7:2019 - Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

IEC TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Emballage de composants pour opérations automatisées - Partie 7: Introduction d’une plaquette thermoformée en volume pour des composants miniaturisés

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Anglicky/Francouzsky Hardcopy
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Označení normy:IEC TR 60286-7:2019
Vydáno:2019-10-14
Jazyk:Anglicky/Francouzsky
DESCRIPTION

IEC TR 60286-7:2019

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

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