Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQE-ReadingNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC TR 62878-2-7:2019 - Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
sklademVydáno: 2019-03-20
IEC TR 62878-2-7:2019 - Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Format
Availability
Price and currency
Anglicky Hardcopy
skladem
90.45 €
Anglicky PDF
Immediate download
90.45 €
Označení normy:IEC TR 62878-2-7:2019
Vydáno:2019-03-20
Jazyk:Anglicky
DESCRIPTION

IEC TR 62878-2-7:2019

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Print