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Homepage>IEC TR 63378-1:2021 - Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
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sklademVydáno: 2021-12-14
IEC TR 63378-1:2021 - Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

IEC TR 63378-1:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

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Označení normy:IEC TR 63378-1:2021
Vydáno:2021-12-14
Jazyk:Anglicky
DESCRIPTION

IEC TR 63378-1:2021

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

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