Menu
0
Total price
0 €
PRICES include / exclude VAT
Homepage>PD IEC TR 61340-5-5:2018 Electrostatics Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing
sklademVydáno: 2018-12-06
PD IEC TR 61340-5-5:2018 Electrostatics Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing

PD IEC TR 61340-5-5:2018

Electrostatics Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing

Format
Availability
Price and currency
Anglicky Secure PDF
Immediate download
290.07 €
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standard
for 1 hour
29.01 €
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standard
for 24 hours
87.02 €
Anglicky Hardcopy
In stock
290.07 €
Označení normy:PD IEC TR 61340-5-5:2018
Počet stran:38
Vydáno:2018-12-06
ISBN:978 0 539 00576 9
Status:Standard
DESCRIPTION

PD IEC TR 61340-5-5:2018


This standard PD IEC TR 61340-5-5:2018 Electrostatics is classified in these ICS categories:
  • 29.020 Electrical engineering in general
  • 17.220.99 Other standards related to electricity and magnetism

This part of IEC 61340 discusses packaging material requirements for electrostatic discharge sensitive items (ESDS) as well as non–ESDS which can apply to packaging materials such as embossed carrier tape, trays, tubes (stick magazines), rails and others used in back end line processing and parts handling where test methods described in other standards are, for the most part, inadequate. Issues related to electrostatic charge generation, electrostatic attraction and repulsion are included. The recommendations and discussions within this document can also be applicable to other types of packaging that cannot be evaluated by other means.

This document discusses the issues related to

  1. technical considerations for packaging material selection and packaging system design,

  2. packaging material specifications for electrostatic control,

  3. existing test methods and their limitations for packaging materials,

  4. suggestions for the evaluation of small dimension packaging materials, and

  5. industry common practices.