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Homepage>PD IEC TR 61760-3-1:2022 Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
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sklademVydáno: 2022-10-31
PD IEC TR 61760-3-1:2022 Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

PD IEC TR 61760-3-1:2022

Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

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Označení normy:PD IEC TR 61760-3-1:2022
Počet stran:30
Vydáno:2022-10-31
ISBN:978 0 539 17936 1
Status:Standard
DESCRIPTION

PD IEC TR 61760-3-1:2022


This standard PD IEC TR 61760-3-1:2022 Surface mounting technology is classified in these ICS categories:
  • 31.190 Electronic component assemblies

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