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sklademVydáno: 2019-04-01
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
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| Označení normy: | PD IEC TR 62878-2-7:2019 |
| Počet stran: | 16 |
| Vydáno: | 2019-04-01 |
| ISBN: | 978 0 539 03359 5 |
| Status: | Standard |
DESCRIPTION
PD IEC TR 62878-2-7:2019
This standard PD IEC TR 62878-2-7:2019 Device embedding assembly technology is classified in these ICS categories:
- 31.180 Printed circuits and boards
- 31.190 Electronic component assemblies
This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.