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Homepage>UNE EN 60191-6-19:2010 Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)

UNE EN 60191-6-19:2010

Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)

Normalización mecánica de dispositivos semiconductores. Parte 6-19: Métodos de medida de deformación (warpage) de paquete a temperatura elevada y la deformación (warpage) máxima permisible (Ratificada por AENOR en septiembre de 2010.)

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Označení normy:	UNE EN 60191-6-19:2010
Počet stran:	17
Vydáno:	2010-09-01
Status:	Norma

DESCRIPTION

This standard UNE EN 60191-6-19:2010 Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.) is classified in these ICS categories:

31.080.01

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