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Homepage>UNE EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
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sklademVydáno: 2011-01-19
UNE EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

UNE EN 60749-19:2003/A1:2011

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 19: Resistencia de la pastilla al cizallamiento.

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Označení normy:UNE EN 60749-19:2003/A1:2011
Počet stran:12
Vydáno:2011-01-19
Status:Změna
DESCRIPTION

This standard UNE EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength is classified in these ICS categories:

  • 31.080.01
Categories:
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