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Homepage>UNE EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
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sklademVydáno: 2004-03-26
UNE EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength

UNE EN 60749-22:2004

Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 22: Robustez de las uniones soldadas.

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Označení normy:UNE EN 60749-22:2004
Počet stran:48
Vydáno:2004-03-26
Status:Norma
DESCRIPTION

This standard UNE EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength is classified in these ICS categories:

  • 31.080.01
Categories:
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