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Homepage>UNE EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
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sklademVydáno: 2013-11-01
UNE EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

UNE EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 18: Métodos de ensayo de doblado para materiales de película fina. (Ratificada por AENOR en noviembre de 2013.)

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Označení normy:UNE EN 62047-18:2013
Počet stran:17
Vydáno:2013-11-01
Status:Norma
DESCRIPTION

This standard UNE EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.) is classified in these ICS categories:

  • 31.080.99
Categories: