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Homepage>UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)

UNE EN 62047-9:2011

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)

Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 9: Medida de la resistencia de la unión oblea a oblea para NEMS. (Ratificada por AENOR en junio de 2012.)

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Označení normy:	UNE EN 62047-9:2011
Počet stran:	29
Vydáno:	2012-06-01
Status:	Norma

DESCRIPTION

This standard UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.) is classified in these ICS categories:

31.080.99

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