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Hlavní stránka>IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV - Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
sklademVydáno: 2012-12-07
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV - Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types

IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV

Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types

Coupe-circuit miniatures - Partie 4: Eléments de remplacement modulaires universels (UMF) - Types de montage en surface et montagepar trous

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Anglicky/Francouzsky Tisk
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Označení normy:IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV
Vydáno:2012-12-07
Jazyk:Anglicky/Francouzsky
Popis

IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV

IEC 60127-4:2005+A1:2008+A2:2012 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors. It does not apply to fuse-links for appliances intended to be used under special conditions, such as in a corrosive or explosive atmosphere. This standard applies in addition to the requirements of IEC 60127-1. This consolidated version consists of the third edition (2005), its amendment 1 (2008) and its amendment 2 (2012). Therefore, no need to order amendments in addition to this publication.

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