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Hlavní stránka>IEC 60191-4:2013 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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sklademVydáno: 2013-10-10
IEC 60191-4:2013 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

IEC 60191-4:2013

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs

Formát
Dostupnost
Cena a měna
Anglicky/Francouzsky Tisk
skladem
4290 Kč
Anglicky/Francouzsky PDF
K okamžitému stažení
4290 Kč
Označení normy:IEC 60191-4:2013
Vydáno:2013-10-10
Jazyk:Anglicky/Francouzsky
Popis

IEC 60191-4:2013

IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code "S" is added to indicate a silicon based package. b) Description of "WL" is added to be used for general use.