Přihlásit seRegistrovat se
Jazyk czen
Menu
KontaktOBCHODNÁPOVĚDAE-ReadingNovinky
Hledání
0
Celková cena
0 Kč
Cena s DPH / bez DPH
Hlavní stránka>IEC 60191-6-1:2001 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
sklademVydáno: 2001-10-30
IEC 60191-6-1:2001 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

IEC 60191-6-1:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Formát
Dostupnost
Cena a měna
Anglicky Tisk
skladem
572 Kč
Anglicky PDF
K okamžitému stažení
572 Kč
Označení normy:IEC 60191-6-1:2001
Vydáno:2001-10-30
Jazyk:Anglicky
Popis

IEC 60191-6-1:2001

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

Tisk