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sklademVydáno: 2001-03-22
IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-6: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception des dispositifs FLGA
Formát
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Cena a měna
Anglicky/Francouzsky Tisk
skladem
2288 Kč
Anglicky/Francouzsky PDF
K okamžitému stažení
2288 Kč
| Označení normy: | IEC 60191-6-6:2001 |
| Vydáno: | 2001-03-22 |
| Jazyk: | Anglicky/Francouzsky |
Popis
IEC 60191-6-6:2001
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.