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Hlavní stránka>IEC 60191-6-6:2001 - Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
sklademVydáno: 2001-03-22
IEC 60191-6-6:2001 - Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

IEC 60191-6-6:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-6: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception des dispositifs FLGA

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Anglicky/Francouzsky Tisk
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2288 Kč
Anglicky/Francouzsky PDF
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2288 Kč
Označení normy:IEC 60191-6-6:2001
Vydáno:2001-03-22
Jazyk:Anglicky/Francouzsky
Popis

IEC 60191-6-6:2001

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

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