Cena s DPH / bez DPH
Sponsored link
sklademVydáno: 2020-08-31
IEC 60749-20:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : Résistances des CMS à boîtier plastique à l’effet combiné de l’humidité et de la chaleur de brasage
Formát
Dostupnost
Cena a měna
Anglicky/Francouzsky Tisk
skladem
5434 Kč
Anglicky/Francouzsky PDF
K okamžitému stažení
5434 Kč
| Označení normy: | IEC 60749-20:2020 |
| Vydáno: | 2020-08-31 |
| Jazyk: | Anglicky/Francouzsky |
Popis
IEC 60749-20:2020
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.