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sklademVydáno: 2006-06-26
IEC 61163-1:2006
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
Déverminage sous contraintes - Partie 1: Assemblages réparables fabriqués en lots
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Anglicky/Francouzsky Tisk
skladem
9867 Kč
Anglicky/Francouzsky PDF
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9867 Kč
Označení normy: | IEC 61163-1:2006 |
Vydáno: | 2006-06-26 |
Jazyk: | Anglicky/Francouzsky |
Popis
IEC 61163-1:2006
This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.