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sklademVydáno: 2003-06-24
IEC 61188-5-2:2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-2: Considérations sur les liaisons pistes-soudures - Composants discrets
Formát
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Anglicky/Francouzsky Tisk
skladem
8580 Kč
Anglicky/Francouzsky PDF
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8580 Kč
| Označení normy: | IEC 61188-5-2:2003 |
| Vydáno: | 2003-06-24 |
| Jazyk: | Anglicky/Francouzsky |
Popis
IEC 61188-5-2:2003
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.