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Hlavní stránka>IEC 61189-11:2013 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
sklademVydáno: 2013-05-07
IEC 61189-11:2013 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 11: Mesure de la température de fusion ou des plages de températures de fusion des alliages à braser

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Anglicky/Francouzsky Tisk
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Označení normy:IEC 61189-11:2013
Vydáno:2013-05-07
Jazyk:Anglicky/Francouzsky
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IEC 61189-11:2013

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

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